New York (TDI): Deputy Prime Minister and Foreign Minister Ishaq Dar said on Thursday that Pakistan is not under any pressure from Washington, and the country would not accept any pressure, even if it was applied.
Wrapping up his US visit, Dar said that relations between Pakistan and the United States were good.
Speaking to reporters before returning to Pakistan, Dar stated he had no official contact with officials from the Trump administration during his trip.
However, he said that an extraordinary meeting of the Council of Foreign Ministers of OIC nations will convene in Jeddah on March 7 to discuss the Gaza situation, especially in light of recent US proposals for the relocation of the Palestinian people.
He said during the interactions, foreign ministers from Iran, Egypt, Malaysia, UAE, Saudi Arabia and Turkiye all urged an immediate meeting to discuss the situation and present the OIC’s stance.
In reply to a query about escalating cross-border attacks by the banned Tehreek-i-Taliban Pakistan (TTP), Dar said Pakistan had repeatedly urged the interim Afghan government to rein in terrorist groups, and would continue to press them on the issue.
Also Read: OIC to Hold Gaza Meeting in Jeddah on March 7: Dar
He revealed plans to visit Afghanistan to remind Afghan leaders of their international obligations, i.e. to not allow their territory to be used for attacks against Pakistan.
Dar said that the menace of terrorism had almost been eliminated from the country in 2018, but blamed the policies of the previous PTI government for its resurgence after a large number of TTP fighters were allowed to re-enter the country.
Also Read: Ishaq Dar meets with Hungarian Foreign Minister in New York
In addition to security concerns, he also reiterated Pakistan’s humanitarian commitment to Afghanistan, underlining the need for its economic development.
“We are committed to promoting Afghanistan’s economic development, including through implementing connectivity projects between Central Asia and Pakistan through Afghanistan,” he said.